The global semiconductor bonding market size was evaluated at $1.8 Billion in 2022 and is slated to hit $3.9 Billion by the end of 2030 with a CAGR of nearly 3.12% between 2023 and 2030.
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➤ The global market trends will be bolstered by the widespread adoption of semiconductor bonding equipment in the aerospace, medical, and consumer electronic products sectors.
The electronics sector has experienced significant development in recent decades, which is a result of Moore’s law and the decreasing costs of semiconductors. This has increased the demand for semiconductors in the electronics sector, thereby establishing a profitable growth trajectory for the global semiconductor bonding market. The global market surge has been significantly influenced by the emergence of new technologies, including artificial intelligence, power-efficient sensing devices, brain-inspired computation, robotics, and automated equipment.
➤ The global industry’s advance is being slowed by the substantial costs of semiconductor bonding equipment ownership.
The expansion of the global semiconductor bonding industry is likely to be impeded by the substantial costs associated with semiconductor bonding device production and ownership. Additionally, the global industry’s expansion may be further impeded by the assembly of a variety of large and small components, such as sensors, displays, and vacuums.
➤ New growth opportunities for the global market are being created by the increasing prominence of 3D semiconductor assembling.
New growth opportunities for the global semiconductor bonding market size will be generated by the thriving packaging sector, the increasing prevalence of 3D semiconductor assembling, and the use of connected things and machine learning tools in a variety of industries.
➤ The industry faces new challenges in terms of global growth due to the volatility of thin wafers and the imbalance of moving elements in semiconductor bonding devices.
The global semiconductor bonding industry may face a significant challenge in its development trajectory due to the volatility of thin wafers and their susceptibility to damage from external stress or pressure. Additionally, the global industry’s development trajectory may be significantly impeded by an imbalance of the moving components of semiconductor bonding.
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The Global Semiconductor Bonding Market is segmented based on product, application and region
Global Semiconductor Bonding Market: Product Segment Analysis
● Die Bonder
● Wafer Bonder
● Flip Chip Bonder
Global Semiconductor Bonding Market: Application Segment Analysis
● RF Devices
● 3D NAND
● CMOS Image Sensors
● LED
● MEMS & Sensors
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The global Semiconductor Bonding market profiles key players such as:
● Kulicke & Soffa
● Moschip Technologies Ltd
● Tata Elxsi Ltd
● Shinkawa Ltd
● Shibaura Mechatronics
● Yamaha Motor Robotics Corporation Co.
● Fuji Corporation
● SPEL Semiconductor Ltd
● Panasonic Corporation
● SUSS MicroTech SE
● ASM Pacific Technology Ltd.
● Fasford Technology
● EV Group
● Ruttonsha International Rectifier Ltd
● Dixon Technologies (India) Ltd
● BE Semiconductor Industries N.V
???? Recent Developments
• GlobalWafers Company Limited, a Taiwanese technology manufacturing company, allocated roughly $339.1 million to the expansion of its silicon wafer unit in Taisil, Taiwan, during the first half of 2020. The objective of the initiative is to augment the demand for silicon wafers in the country and around the world.
• HANMI Semiconductor, a semiconductor company headquartered in South Korea that specializes in the production of semiconductor equipment, introduced the new flip chip bonder 5.0 in August 2020. The objective of the strategic maneuver is to augment South Korea’s semiconductor production. The initiative is expected to expand the demand for semiconductor bonding equipment in the Asia-Pacific region and South Korea. Additionally, it will stimulate the expansion of the semiconductor bonding industry in the Asian subcontinent.
➤ In 2023-2030, the semiconductor bonding market in the Asia-Pacific region is expected to see the highest compound annual growth rate (CAGR).
The semiconductor bonding market in the Asia-Pacific region is anticipated to experience the most significant development rate during the forecasting period. China, Taiwan, and South Korea are the world’s foremost semiconductor manufacturers, which accounts for the regional market’s expansion from 2023 to 2030. Furthermore, the regional market’s expansion in the years ahead will be significantly influenced by the presence of significant manufacturers in the region.
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